WHERE TO USE
SikaBond-T100 may be used for solid and engineered wood floors (strips, long strips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, Sikabond-T100 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
FEATURES AND BENEFITS
́ Unlimited subfloor moisture transmission
́ Easily cleans off prefinished floors before and after cure ́ Contains no water, solvent or isocyanates
́ Low moisture vapor permeability
́ No moisture testing required – a dry to touch substrate is the only requirement
́ Meets local IIC and STC sound reduction codes
́ Crack Bridging
́ Very easy to spread
́ Low odor
́ Advanced Hybrid Technology
́ Excellent green grab
́ Permanently elastic – allows planks to expand and contract without damage to the adhesive
́ Tenacious Bonding
NOTE: Always refer to Current Product data Sheet and SDS for detailed performance specifications prior to use.